The Development and Design for Straightening the Microprobe Materials

Autor: Zhen-Rong Wang, 王振榮
Rok vydání: 2009
Druh dokumentu: 學位論文 ; thesis
Popis: 97
Most of the microprobe materials used on the array-type cantilever microprobe card in semi-conductor industry, are made of thin rhenium-tungsten alloy. The materials of rhenium tungsten alloy come in two forms. It can either come in the form that the materials are already being divided into specific length, which will be costly; or come in a bundle, which will be much cheaper. This paper will mainly discuss about the commonly used materials in the straightening machines for rhenium-tungsten alloy microprobe which is made up of rhenium tungsten alloy with a diameter of 0.175mm. Moreover, it will also discuss about the machines and techniques used for straightening the microprobe materials, designed in axial tension to control the strain. Through the strain test and the self designed experiment to test for manual tension, we have derived that the use of 0.175mm of rhenium tungsten alloy with tension between to, will achieve a standard straightening result. The earliest method for straightening is through manual straining machines to pull axially to create an overlapping result. It then evolved into the simultaneous straightening machine for rhenium tungsten alloy of diameter 0.175mm. The machine is powered by a pressure vessel. The ultra-thin pressure vessel exerts force on the 0.175mm rhenium tungsten alloy, with a fixed and long displacement to supply and provide materials. Instead, the control of strain is managed by a pressure vessel with adjustable displacements. It makes use of the adjustable distances to control the axial strain at, and improve the stability and repetition with the combination of sliders and tracks. After conducting the final test using the straightening machine, the diameter of the rhenium tungsten alloy has achieved to be 0.175mm which corresponds to the standard result.
Databáze: Networked Digital Library of Theses & Dissertations