Optimization of Molding Process in IC Assemblyusing the Taguchi method
| Autor: | Hua-Ming Huang, 黃華明 |
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| Rok vydání: | 2009 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 97 BGA (Ball Grid Array) assembly technology is mainly adopted for current IC assembly processes. BGA would result in better electronic characteristic, conductivity and smaller size than other assembly methods e.g. QFP, PLCC etc. This research aims at the investigating the effects of molding parameters in the DUFU BGA assembly process on product quality for semiconductor IC assembly. In the molding process the defects of the mold flash, the wire sweep and the voids in molding compound are the important performance indexes. First, The Taguchi method is used to find the seven optimal process parameters e.g. the mold temperature, Transfer Time, End time pressure, pellet pre-heater time, Clamp Presure,BGA OPEN STEP and compound life. Then, the actual defect causes of product quality are found out by the failure ratio with the comparison of the optimal and initial parameter groups in the experiments. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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