Planning of Post-Mold Curing Operation in IC Packaging
| Autor: | Shu-ting Kang, 康舒婷 |
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| Rok vydání: | 2009 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 97 The post-mold cure operation is the back-end process of integrated circuit packaging in semiconductor industry. It involves baking the encapsulated IC in an oven for about 6-24 hours and at constant temperature. The main function of the baking is curing the compound and removing moisture in IC chip. For optimum utilization of the capacity of oven, ovens have to be constantly opened for incoming lots, even though they may be currently active at that time with existing lots inside. In such cases, when the oven is opened during the baking process, the humidity within the oven will rise and the interior temperature of the oven will be greatly affected. This problem is solved in practice by increasing the baking time. Consequently, this may reduce the effect of opening the ovens frequently. Nevertheless, such an increase and addition of extra time does not settle the root cause behind the problem of incomplete baking. To address and solve the problems aforementioned, the start-baking time, end-baking time, and the lot locations in the ovens can be determined and decided upon using an algorithm that can effciently reduce and optimize the oven opening frequency. This thesis focuses on planning of post-mold curing operation in IC packaging. It constructs the problem model and then proposes algorithms in different cases to solve this problem. Finally it compares the results with different parameters to provide relevant information as a reference to the industry. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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