The Stress Analysis of the Adhesive's Influences on Bonded Substrate
| Autor: | Bo-Yang Li, 李柏泱 |
|---|---|
| Rok vydání: | 2009 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 97 In this investigation, the adherend of the adhesively bonded joint is modeled as a 1-D beam. Based on the mechanics of material, the analytical solutions of the shear and peel stresses in the adhesive are obtained first, and by considering the force-balance of the system, the strain of the adherend can be obtained. Then, the analytical solutions of adhesive’s stress and adherend’s strain are compared with the 2-D finite element solutions (numerical solution). The analysis of bonded joints involves three different types of applying loadings: axial force, moment, and both axial force and moment. The distribution of the adhesive’s stresses and the strain of adherend are discussed. The parameters which may effect the distribution of the adhesive’s stresses and the adherend’s strain, including mechanical properties, geometries of adhesive/adherend, and the length of bonded joints are studied. Finally, an experimental tensile test with axial force on bonded joints is set to validate the analytical solutions of the adherend’s strain distributions. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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