The study of the effect of temperature variation in bond-ability for PPF leadframe
| Autor: | Yueh-liang Hsu, 徐岳樑 |
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| Rok vydání: | 2007 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 96 In this thesis, we have demonstrated an invented structure of pre-plating lead-frame (PPF) processing to replace the conventional Sn-Bi / Sn-Cu plating structure which attracted interest of research for developing green processing for semiconductor packaging. Wire bond capillary abrasion method has been use to study the effect of heat block temperature, and structures of PPF Design of Experiment analysis has also been used to study the failure modes of second bonding in PPF wire bonding. We have achieved the optimized parameters in PPF wire bonding process by adjusting the temperature of the heat block to improve the bonding liability in PPF wire bonding process at elevated temperature. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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