Thermal Deformations and Stress Distributions of Flip-Chip BGA Package under Thermal Environment
| Autor: | Chung-Ju Wang, 王鍾儒 |
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| Rok vydání: | 2008 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 96 Following the market demands and progress of science and technology, the development of consuming and portable electronics tend to become small, light, and multi-functional for recent years. For these requirements, flip chip technology has become popular rapidly owing to their high electronic performance, high I/O density, and smaller package size capabilities. However we should take thermal effects seriously because of packages may be damaged when package size became smaller. Therefore, it is significant that the measurement and estimation of thermal deformation behavior of chips by reliable whole-field optical method and finite element analysis. In this thesis, we combined Twyman-Green interferometry with phase-shifting technique for the experimental measurement. Using the phase-shifting technique will improve resolution and practicability of interferometry, and reduce inaccuracy caused by counting fringe orders directly when applying Twyman-Green interferometry only. We measure thermal deformations of flip chip BGA package under thermal environment. Meantime we use finite element analysis software ANSYS for 3D model thermal stress analysis, then compared with the modified Suhir theoretical solution. After verifying validity between experimental results, finite element solution, and modified Suhir theoretical solution, we demonstrate that the thermal deformations, die stress, and shear stress distributions of flip chip BGA package can almost expressed by finite element analysis, thus they can provide a reliable methodology for design and analysis in the thermal effects of different types of flip chips. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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