Effect of Mg on the properties of Lead-Free solders and its Application to joining ceramics
| Autor: | Li-Chang Liu, 劉力彰 |
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| Rok vydání: | 2007 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 95 The effect of Mg addition in Sn, In, Sn3Ag0.5Cu and In48.3Sn36.1Bi solder alloys on wettability of ceramics and metals was investigated .The melting ranges of the four Mg containing solder systems were determined with differential scanning calorimetry (DSC). The intermetallic compounds in the four solder systems, Sn-Mg, In-Mg, Sn-Ag-Cu-Mg and In-Sn-Bi-Mg, were characterized by metallographic microstructure, elemental analysis and phase diagrams. In this study, the wettability, mechanical properties and microstructures of the solder systems. Sn-Mg alloys with 0.1%, 0.5%, 1% and 2.2% Mg, In-Mg alloys with 2.2Mg, Sn3Ag0.5Cu-Mg with 1% and 2% Mg, and In48.3Sn36.1Bi-Mg with 2.2% Mg, were analyzed in comparison with the solders without Mg. The microstructure characteristics of Sn-Mg with different amount of Mg specify that Mg2Sn in Sn matrix increases with the amount of Mg addition .Sn-Ag-Cu-Mg alloys were used to study the wetting behavior on copper. The results showed that the contact angles decreased with Mg in Sn3Ag0.5Cu alloy increasing. Moreover, Mg addition rose the forming rate of the intermetallic compounds. DSC melting range analysis indicated that the melting points didn’t vary noticeably with the Mg content of the solder alloys. With the addition of Mg in Sn-Mg alloys, the melting points of the solder were reduced. There was a lowest melting point of the solders with 2.2% Mg content. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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