Embedded Process and Characterization Analysis of Discrete Capacitor in Organic-Base Substrate

Autor: Jui-Wen Wang, 王瑞文
Rok vydání: 2007
Druh dokumentu: 學位論文 ; thesis
Popis: 95
The world is turning toward the high information today of the direction move forward, delivering exchanges by the information with configuring global communication information a net, making us no longer be subjected to restriction of being limited by the region and space. Develop therefore and actively new of passive component in the manufacturing process technique in the substrate to raise additional value and market competition ability of product, and expand the applied level of product and face widely, substrate manufacturing in face the increasingly vigorous competition environment, the strategy must be take. and cost/area saving denser packaging. Hide the substrate of passive component to study aspect in this, introduce how to cover up a 0402 electric capacities in a related manufacturing process which substrate inner part and follow-up electricity characteristic an improvement. By through hole or Laser drill hole to integrate long-lost electric capacity heel substrate circuit together. Make use of the vector network analysis instrument to combine a high Pin probe probing system to carry on a related measurement, and make use of the Ansoft 3 D EM software HFSS to carry on electric circuit characteristic emulation. According to this research result, cover up in substrate pack inside electric capacity, in addition to canning knot province surfacing to stick to the substrate area neededing effectively, increasing the substrate circuit Bu line freedom, make use of passive component high-quality factor characteristic to cut over by repressing a high-speed signal a noise application up, inside cover up a passive component to repress result to compare surface to stick to a passive component obviously to repress result in the substrate surface better.
Databáze: Networked Digital Library of Theses & Dissertations
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