The Adhesion Study of Polyimide Film on DLCH Film
| Autor: | Fong-Cheng Tai, 戴豐成 |
|---|---|
| Rok vydání: | 2007 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 95 The main purpose of this study is to investigate the interfacial adhesion and bonding structure of polyimide/hydrogenated diamond-like carbon structure. There are three parts in this study； The first part involves the deposition of 1μm thick DLCH film on Si wafer surface by using ion beam method consists of high hardness and good insulating property. Samples were post annealed for understanding the thermal stability of DLCH film under N2 atmosphere annealed treatment at 300℃, 350℃ and 400℃ for one hour, respectively。The thermal stability is correlated between two characteristic indexes of DLCH film and is verified by Raman spectrum (ID/IG ratio) in visible range and XPS (sp2/sp3 ratio). The experimental shows that the DLCH film begins to induce graphitization at 300℃. The ID/IG ratio exists a positive dependency on the sp2/sp3 ratio. The second part involves a 6μm thick polyimide film is spin-coated on Si wafer surface, followed by the N2 curing treatment of the PI film at 300℃, 350℃ and 400℃ for one hour, respectively. A 92 % curing degree at 300℃ for 1hr of PI film is measured from ATR-FTIR measurement. Higher curing degree facilitates the higher nano-hardness and nano-elastic modulus. The third part involves the preparation of PI(6 μm)/DLCH(1μm) on Si wafer, followed by N2 gas curing treatment at 300℃for one hour to stabilize the PI/DLCH hybrid structure. The polyimide film with tensile strength 0.09 GPa can partially release the DLCH film with compressive stress 1.82 GP by wafer warpage measurement. The polyimide film can be used to passivate the DLCH film due to the electrical resistance of polyimide film (5.34x1014Ω-cm) is 2000 times higher than that of DLCH film (2.72*1011Ω-cm). The simple tape test shows that there is no peeling phenomenon on the Polyimide/DLCH structure, the microhardness test shows that the Polyimide/DLCH structure doesn’t happen cracking until under 3N load. One possible interfacial adhesion mechanism for hydrogen bond about polyimide/DLCH interface will be proposed from interfacial bonding states of epoxy/PI、PI/Cu and SAMs/DLCH hybrid structure. From experimental results, the polyimide(300℃)/DLCH(300℃) hybrid structure is one possible lower temperature process relative to polyimide(400℃)/Si3N4(400℃) with higher temperature for repassivation process. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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