The Study of Performance of Liquid Cooling System on Electronic Chip
| Autor: | Ching-Hsien Lai, 賴靜仙 |
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| Rok vydání: | 2007 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 94 Recently, the thermal design power of a CPU of desktop computers has been increasing. It is therefore imperative to employ a sounding heat dissipation scheme to maintain a stable performance of the CPU. In addition, it has been verified that the thermal performance of a liquid cooling system is better than that of an air cooling. A study of the thermal performance of a liquid cooling system with the aides of experiment and numerical simulations is reported in this paper. The characteristics of the components including the fan, water pump, water block, and radiator as a whole are measured. The numerical simulation is carried out by using CFD software ICEPAK. Some experimental data are employed as the boundary conditions for facilitating the numerical simulation for the liquid cooling system. The numerical results show that the thermal resistance associated with the boundary conditions of the PS- curve imposed on the active components (that is, the fan and the water pump) may deviates up to 115% off that with an operating working condition. This operating working condition when imposed delivers a thermal resistance with an error less than 4% comparing with that obtained experimentally. As the accuracy of the numerical simulation is confirmed, a design procedure feasible for liquid cooling systems is proposed accordingly. This procedure is considered being able to estimate the performance of the liquid cooling system without performing lab experiments; thus, the value of numerical simulation can be exploited thoroughly. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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