A Study of The Fixed Abrasives Pad is worn and conditioned
| Autor: | Psung-Pen Hsu, 徐宗本 |
|---|---|
| Rok vydání: | 2004 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 92 Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. The polishing pad is one of the primary consumables in CMP. Extending the life of polishing pad can reduce cost of consumables and improve process stability. The purpose of this thesis is to study the method of dressing a fixed abrasive pad to prolong its lif e and proving the method workable. The fixed abrasive pad is dressed by a round slice that is coated diamond-like carbon about 0.3µm. We have found that using the nano-diamond dresser can dress the fixed abrasive pad. After conditioning the roughness of abrasive layer in the fixed abrasives pad resume. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
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