Growth Mechanism of Intermetallic Compound and Creep Behavior of Lead-free/Lead-containing Solder Joints
| Autor: | Chia-Wei Fan, 范嘉偉 |
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| Rok vydání: | 2004 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 92 |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
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