Physical Properties ,Curing Kinetics and Chemorheologies of Cyanate Ester Cured Main Chain Rigid-Rod Epoxy Resin

Autor: Chi-Ping Lee, 李紀平
Rok vydání: 2002
Druh dokumentu: 學位論文 ; thesis
Popis: 90
This thesis comprises two parts. In the first part, we investigate the differences of thermal properties, dielectric properties, curing kinetics, curing chemorheologies between cyanate ester cured rigid rod epoxy and cyanate ester cured flexible commercial epoxy. Rigid rod resin with liquid crystalline properties: biphenol epoxy resin (BP) and conventional epoxy resin of diglycidyl ether of bisphenol A (DGEBA), were cured by 2,2’-bis(4-cyanatophenyl) propane (B10) with the ratio of 1: 0.5 and 1:1. The curing activation energy were obtained by using differential scanning calorimetry (DSC). Thermomechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and thermogravimetric analyzer (TGA) were used to determine the thermal properties, including the glass transition temperatures, thermal expansion coefficients and decomposition temperatures. Dielectric analyzer (DEA) was used to determine the dielectric properties. The curing chemorheologies were investigated by rheometer. Anisotropic BP/B10(1: 0.5) with higher Tg, decomposition temperature and lowest thermal expansion coefficients. The rigid rod structures of epoxy affect the molecular motion and result in higher curing temperature and longer cure time than flexible epoxies. Cyanate cured rigid rod epoxy resins exhibit good thermal properties and dielectric properties due to the rigid structure of cured networks. Liquid crystalline epoxy resin with low melting viscosity can be used in underfill materials. SiO2 (filler) particle size also affect the viscosity of underfill materials. In the second part, we discuss how to control the underfill filler's(silica) particle size, shape and to reduce underfill viscosity. The silica particle in the size of 650nm with close packed ordered structure can be used in photonic crystal materials.
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