The Research of Diamond Wire Slicing Brittle Materials and Process Parameters
| Autor: | CHIA-HAO TENG, 鄧嘉豪 |
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| Rok vydání: | 2002 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 90 At present, diamond grain wire slicing is the tool that uses fixed abrasives to cut ceramic and other brittle materials. Contrast to free abrasive wire slicing, fixed abrasive wire slicing can improve material removal rate and make the diamond grain used efficiently. So it can promote the productivity of material. In order to make the diamond grain wire saw apply to high cost production in semiconductor industry such as wafer slicing. This paper researches the brazed diamond grain wire saw that the Kinik company manufactures. First we deduce Single-diamond grain remove material volume formula. It is helpful to realize the process of diamond grain remove material. And through some experiment to analysis and discuss the formula .Second we focus on surface roughness about 1μm and observe the effect that process parameters ( feed velocity、wire velocity、feed pressure) to working parameters(material remove rate、surface roughness).By Calculating average feed velocity of single-diamond grain, we can use ductile regime theorem to explain the process of diamond grain slicing brittle materials；Finally we use neural network to simulate the effect that process parameters to working parameters, find out the suitable process parameters, and discuss the workable of diamond grain wire slicing brittle materials. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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