Reliability Analysis of Optical Fiber Array Modulus for Transceiver
| Autor: | Hsiao-Tung Ku, 顧曉東 |
|---|---|
| Rok vydání: | 2002 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 90 The effect of thermal stress/strain distribution and the displacement of optical fiber in the optical fiber array module under cyclic thermal loading are investigated in this thesis. A general-purpose of finite element system ANSYS is adopted in this research for thermal and mechanical behavior analysis. This research consists of three parts. In the first part, contact element models are used to investigate the relation between the contact force and contact stiffness when the optical fiber array module is subjected to a temperature cycling condition. Moreover, the simplification of contact element models is also discussed in this research. In the second part, non-contact element models are applied to study the reliability characteristics of optical fiber array module under cyclic thermal loading. There are two cases for the non-contact element models to handle the surface between top and bottom silicon of the optical fiber array model; one is bonding free and the other one is perfectly bonding conditions. Furthermore, the research discusses with the comparison of analysis results between the two models. For the third part, the investigation considers that the displacement of optical fiber in the X、Y、Z directions under cyclic thermal loading. The simulation results of optical fiber array module can fulfill the reliability demands. In addition, the displacement of optical fiber in the optical fiber array module is in reasonable and allowable range. Consequently, this study gives a methodology for the design of the optical fiber array module. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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