Research and Development of Ultraprecision Polisher with Continuous Composite Electroplated Polishing Disc and Polishing Characteristics of Silicon Wafer
| Autor: | Chang-Li Yao, 姚昶劦 |
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| Rok vydání: | 2002 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 90 The polishing stocks used in various ultra-precision polishing machines consist of abrasives, polishing disk (pad), and polishing fluids. They are expendable goods. To ensure the machining ability and the repeat accuracy of machining characteristics, the polishing disc (pad) must use the dressing mechanism to produce sharp new grains. As a result, the grinding surface on the abrasive wheel becomes thinner gradually, then losses it’s machining ability, and finally must be changed. Hence, in this project, an idea of an ultra-precision abrasive machining is proposed by using the continuous composite electroplating on the polishing disc. In this idea, the machining ability of Cu polishing disc can be ensured due to the use of the continuous Sn-Al2O3 composite electroplating. Hence, it can save the cost of the ultra-precision machining using in the semiconductor wafer. In this study, after 60 minutes continuous composite electroplated polishing, the thickness of the composite coating on the surface of Cu polishing disc can increase 6.13μm. It means the surface of disc can be grew and renewed at every moment. The removal amount of the wafer is 10.8μm. The surface of wafer was Ra=0.5453μm and Rmax=5.464μm at the start, but came to Ra=0.0019μm and Planess=2.649μm/36mm after 60 minutes polishing. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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