The Relationship between Wear and Mechanical Properties of The CMP Pad
| Autor: | 徐任賢 |
|---|---|
| Rok vydání: | 2001 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 89 Pad, consumable product of CMP is one of most important factor in the polishing process. Until now, pad is dependent on import. No domestic manufacturer has this technology and nobody really understand the characteristics of pad. All of the pad information, like the compressibility, pad life rely on the foreign manufacturer. There is no any acknowledged standard or instrument to check pad’s quality. with the polish time(wear) by modeling and experiments. The trend of K for single pad and composite pad follows the wear of pad is exactly opposite. In spite of this, the variation of K follows wear is regular. So, theoretically, it’s practicable that use compressibility as the standard to diagnose if pad is good for polishing. Then, we cooperate with the ASIA Microprocess, INC. to develop a instrument can measure K on-line, and establish some useful This present study found the variation of compressibility(K) of two types of the major pad(single layer pad and composite pad) standard. The instrument(K-meter) will help people to judge the state of the CMP pad more reasonable and easily. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
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