A research on the effect of packaging on the performance of micro-thermal-resistor temperature sensor
| Autor: | Ching-Tien Lin, 林慶典 |
|---|---|
| Rok vydání: | 2000 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 88 The thermal-sensing elements of the body temperature sensor are resistors. The fabrication process of sensor is surface micromachining. It uses constantan as metal strips, and there are four various widths and distances between them. Then, realize their effect on the performance of the sensor. After packaged, build two dimension model with ANSYS to perform simulation and analysis of heat transfer. Then, discuss the effect of floating membrane under the thermoresistors on the response time and sensitivity of sensor. After analysis with ANSYS, we obtain two parameters that will influence the performance of sensor. As thickness of floating membrane is less then 100μm, the heat balance time is similar. The heat balance time will raise with the increase of thickness. Therefore, we confirmed that floating membrane is efficient to reduce the thermal mass of sensor structure. The heat balance time will raise with the increase of packaging thickness. A 100μm thick packaging can protect the sensing element and wire, and the effect on the performance can be accepted. The two following parameters will not influence the performance, type of metal strips and thickness of metal thin-film. So we can increase the number of wire to raise output signals of sensor, and reduce the thickness of metal thin-film deposition. The time and cost of manufacture will be down. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
|