銀厚膜表面蒸鍍銦、錫後之固液擴散接合實驗
| Autor: | Long-wei Huang, 黃隆瑋 |
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| Rok vydání: | 1999 |
| Druh dokumentu: | 學位論文 ; thesis |
| Popis: | 87 Solid-liquid interdiffusion (SLID) bonding between silver and indium, and silver and tin has been investigated in this study to develop heat-resistant microjoints for thick-film conductors. Silver conductive thick film (8μm in thickness) was coated by a layer of indium(8 or 3μm) or tin(3.5μm) using thermal evaporization method. Two pices of the In-coated or Sn-coated specimens were compressed at 0.03-0.04 Mpa and heated at temperatures hight than the melting points of In and Sn. The bonding phases of the micropoints were examined by through SEM, EPMA and XRD. The bonding strength of the microjoints was drtermined using shear test. Through the analysis data, a mechamism of Ag-In and Ag-Sn SLID for thick films is proposed. |
| Databáze: | Networked Digital Library of Theses & Dissertations |
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