Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching
| Autor: | Pal, Prem, Sato, Kazuo |
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| Jazyk: | angličtina |
| Rok vydání: | 2008 |
| Druh dokumentu: | Article(publisher) |
| DOI: | 10.1109/MHS.2008.4752414 |
| Databáze: | Networked Digital Library of Theses & Dissertations |
| Externí odkaz: |
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