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ELECTROMAGNETIC ANALYSIS OF PLANAR LAYERED STRUCTURES Fatma Caliskan 169 pages Directed by Dr. Andrew F. Peterson The electrical design of microelectronic devices and their packaging is complicated because of non-ideal attributes of the actual circuit realization. Electromagnetic modeling offers the possibility of accurately predicting the electrical performance of devices and reducing the cost associated with the design process. The proposed research concerns extensions of electromagnetic modeling techniques and their application to microelectronic package design. The method of moments (MoM) is utilized as a technique in modeling and analyzing these designs. Recently, an alternate approach called the locally corrected Nystrm method (LCN) has been applied to solve integral equations in electromagnetics. Recent research suggests that the LCN is well-suited for higher-order implementations and does not require cell-to-cell current continuity in the underlying representation. Thus it may offer advantages over the MoM, especially for problems involving complex 3-D structures. If cell-to-cell continuity is not required, nonconforming meshes may offer simpler geometrical modeling. In this proposal, we consider applying the above techniques to problems in package designs, which often involve multilayer structures, solid or perforated ground planes, embedded passive devices such as capacitors and spiral inductors, and interconnects in horizontal or vertical directions. Several examples will be used to illustrate the modeling. |
