A Resonating Comb/Ring Angular Rate Sensor Vacuum Packaged Via Wafer Bonding
| Autor: | Zarabadi, S., Vas, T., Sparks, D., Johnson, J., Jiang, Q., Chia, M., Borzabadi, E. |
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| Zdroj: | SAE Transactions, 1999 Jan 01. 108, 1934-1938. |
| Databáze: | JSTOR Journals |
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