Reliability Considerations in the Use of Integrated Circuit Packaging Systems in an Automotive Environment

Autor:	Thielmann, J. N.
Zdroj:	SAE Transactions, 1977 Jan 01. 86, 1047-1080.
Databáze:	JSTOR Journals
Externí odkaz:	https://www.jstor.org/stable/44648137 Zobrazit plný text záznamu