Corrosion Protection of Copper Using Organic Solderability Preservatives

Autor:	Artaki, I., Ray, U., Gordon, H.M., Opila, R.L.
Zdroj:	Circuit World, 1993, Vol. 19, Issue 3, pp. 40-45.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/eb046211 Zobrazit plný text záznamu