No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

Autor:	Lau, J., Govila, R., Larner, C., Pao, Y.‐H., Erasmus, S., Dolot, S., Jalilian, M., Lancaster, M.
Zdroj:	Circuit World, 1992, Vol. 19, Issue 1, pp. 19-26.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/eb046187 Zobrazit plný text záznamu