Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability
| Autor: | Lau, J., Dody, G., Chen, W., McShane, M., Rice, D., Erasmus, S., Adamjee, W. |
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| Zdroj: | Circuit World, 1992, Vol. 18, Issue 2, pp. 13-19. |
| Databáze: | Emerald Insight |
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