Design Constraints for the Use of Insulated Metal Substrates®

Autor:	Fick, H.
Zdroj:	Microelectronics International: An International Journal, 1993, Vol. 10, Issue 1, pp. 58-60.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/eb044491 Zobrazit plný text záznamu