High‐density Multichip Module by Chip‐on‐Wafer Technology

Autor:	Kimijima, S., Miyagi, T., Sudo, T., Shimada, O.
Zdroj:	Microelectronics International: An International Journal, 1990, Vol. 7, Issue 1, pp. 33-35.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/eb044400 Zobrazit plný text záznamu