Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste
Autor: | Artaki, I., Jackson, A.M., Vianco, P.T. |
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Zdroj: | Soldering & Surface Mount Technology, 1995, Vol. 7, Issue 2, pp. 27-32. |
Databáze: | Emerald Insight |
Externí odkaz: |