Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste

Autor:	Artaki, I., Jackson, A.M., Vianco, P.T.
Zdroj:	Soldering & Surface Mount Technology, 1995, Vol. 7, Issue 2, pp. 27-32.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/eb037896 Zobrazit plný text záznamu