A study on the thermomechanical response of various die attach metallic materials of power electronics

Autor:	Gharaibeh, Mohammad A., Wilde, Jürgen
Zdroj:	Soldering & Surface Mount Technology, 2024, Vol. 36, Issue 3, pp. 192-199.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/SSMT-12-2023-0068 Zobrazit plný text záznamu