Effects of high current density on lead-free solder joints of chip-size passive SMD components

Autor:	Geczy, Attila, Straubinger, Daniel, Kovacs, Andras, Krammer, Oliver, Mach, Pavel, Harsányi, Gábor
Zdroj:	Soldering & Surface Mount Technology, 2018, Vol. 30, Issue 2, pp. 74-80.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/SSMT-10-2017-0032 Zobrazit plný text záznamu