Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

Autor:	Erer, Ahmet Mustafa, Oguz, Serkan
Zdroj:	Soldering & Surface Mount Technology, 2019, Vol. 32, Issue 1, pp. 19-23.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2018-0028 Zobrazit plný text záznamu