Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys

Autor:	Gharaibeh, Mohammad, Stewart, Aaron J., Su, Quang T., Pitarresi, James M.
Zdroj:	Soldering & Surface Mount Technology, 2018, Vol. 31, Issue 2, pp. 77-84.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/SSMT-07-2018-0020 Zobrazit plný text záznamu