Effect of the IMC layer geometry on a solder joint thermomechanical behavior

Autor:	Capela, Paulina Araújo, Souza, Maria Sabrina, Costa, Sharlane, Teixeira, Jose C., Fernandes, Miguel, Figueiredo, Hugo, Delgado, Isabel, Soares, Delfim
Zdroj:	Soldering & Surface Mount Technology, 2022, Vol. 35, Issue 2, pp. 70-77.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/SSMT-04-2022-0035 Zobrazit plný text záznamu