Research on microstructure and mechanical behaviour of smaller microbumps for high density solder interconnects
| Autor: | He, Man, Wang, Bo, Xia, Weisheng, Chen, Shijie, Zhu, Jinzhuan |
|---|---|
| Zdroj: | Soldering & Surface Mount Technology, 2017, Vol. 29, Issue 3, pp. 156-163. |
| Databáze: | Emerald Insight |
| Externí odkaz: |
|