Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

Autor:	Kakitani, Rafael, Pinto da Silva, Cassio Augusto, Silva, Bismarck, Garcia, Amauri, Cheung, Noé, Spinelli, José Eduardo
Zdroj:	Soldering & Surface Mount Technology, 2021, Vol. 34, Issue 1, pp. 24-30.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/SSMT-01-2021-0003 Zobrazit plný text záznamu