Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Autor:	Wang, Xiuqi, Sun, Fenglian, Han, Bangyao, Cao, Yilun, Du, Jinyang, Shao, Long, Liu, Guohuai
Zdroj:	Soldering & Surface Mount Technology, 2021, Vol. 34, Issue 2, pp. 96-102.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/SSMT-01-2021-0001 Zobrazit plný text záznamu