Wafer damage issue study by heavy Al wire wedge bonding

Autor:	Zhang, Hanmin, Hu, Ming, Zong, Fei, Yin, Baoguan, Ye, Denghong, He, Qingchun, Wang, Zhijie
Zdroj:	Microelectronics International, 2014, Vol. 31, Issue 2, pp. 129-136.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/MI-10-2013-0048 Zobrazit plný text záznamu