3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process

Autor:	Mohammad Nazri, Muhammad Hakeem, Yong, Tan Chou, Yusof, Farazila B., Soon How Thien, Gregory, Yoong, Chan Kah, Kar, Yap Boon
Zdroj:	Microelectronics International, 2024, Vol. 41, Issue 4, pp. 186-195.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/MI-08-2022-0145 Zobrazit plný text záznamu