Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Autor:	Leong Gan, Chong, Classe, Francis, Lee Chan, Bak, Hashim, Uda
Zdroj:	Microelectronics International, 2014, Vol. 31, Issue 2, pp. 121-128.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/MI-07-2013-0036 Zobrazit plný text záznamu