W-band antenna in package module with hybrid glass-compound WLFO process

Autor:	Wang, Gang, Xia, Chenhui, Wang, Bo, Zhao, Xinran, Li, Yang, Yang, Ning
Zdroj:	Microelectronics International, 2022, Vol. 40, Issue 2, pp. 104-108.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/MI-06-2022-0111 Zobrazit plný text záznamu