BGA substrate outgassing negative impact study on Cu wire bonding
Autor: | Zhang, Hanmin, Hu, Ming, Wang, Zhijie, He, Qingchun, Ye, Denghong |
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Zdroj: | Microelectronics International, 2017, Vol. 34, Issue 2, pp. 84-90. |
Databáze: | Emerald Insight |
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