Modelling of temperature distribution along PCB thickness in different substrates during reflow

Autor:	Straubinger, Daniel, Bozsóki, István, Bušek, David, Illés, Balázs, Géczy, Attila
Zdroj:	Circuit World, 2020, Vol. 46, Issue 2, pp. 85-92.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/CW-07-2019-0074 Zobrazit plný text záznamu