Characterization of the surface morphology of electroless NiP deposited on conductive Cu film

Autor:	Huh, Seok-Hwan, Choi, Sung-Ho, Shin, An-Seob, Jeong, Gi-Ho, Ham, Suk-Jin, Kim, Keun-Soo
Zdroj:	Circuit World, 2015, Vol. 41, Issue 4, pp. 137-146.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/CW-01-2015-0003 Zobrazit plný text záznamu