Analytical model of a T-core coil above a multi-layer conductor with hidden hole using the TREE method for nondestructive evaluation

Autor:	Zhang, Siquan
Zdroj:	COMPEL -The international journal for computation and mathematics in electrical and electronic engineering, 2021, Vol. 40, Issue 6, pp. 1104-1117.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/COMPEL-03-2021-0099 Zobrazit plný text záznamu