Simulation of induction thermography NDT technique using SIBC

Autor: Ba, Abdoulaye, Bui, Huu Kien, Berthiau, Gérard, Trichet, Didier, Wasselynck, Guillaume
Zdroj: COMPEL -The international journal for computation and mathematics in electrical and electronic engineering, 2020, Vol. 39, Issue 5, pp. 1071-1083.
Databáze: Emerald Insight