Reducing electronic component losses in lean electronics assembly with Six Sigma approach

Autor:	Ping Yi, Tan, Jeng Feng, Chin, Prakash, Joshua, Wei Ping, Loh
Zdroj:	International Journal of Lean Six Sigma, 2012, Vol. 3, Issue 3, pp. 206-230.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/20401461211282718 Zobrazit plný text záznamu