Reducing electronic component losses in lean electronics assembly with Six Sigma approach
Autor: | Ping Yi, Tan, Jeng Feng, Chin, Prakash, Joshua, Wei Ping, Loh |
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Zdroj: | International Journal of Lean Six Sigma, 2012, Vol. 3, Issue 3, pp. 206-230. |
Databáze: | Emerald Insight |
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