Combifilm: A Novel Thick‐ and Thin‐film Technology with Two Signal Layers for High‐speed Hybrid Circuits Signal Layers for High‐speed Hybrid Circuits

Autor:	Pedersen, U.P.I., Aaserud, O., Bungum, O.W.
Zdroj:	Microelectronics International: An International Journal, 1996, Vol. 13, Issue 1, pp. 16-19.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/13565369610800179 Zobrazit plný text záznamu