Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms

Autor:	Jeevan, K., Quadir, G.A., Seetharamu, K.N., Azid, I.A.
Zdroj:	Microelectronics International: An International Journal, 2005, Vol. 22, Issue 3, pp. 3-15.
Databáze:	Emerald Insight
Externí odkaz:	http://www.emeraldinsight.com/doi/10.1108/13565360510610486 Zobrazit plný text záznamu